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COM Express Module employs 6th Gen Intel Core i7/i5/i3 CPUs.
2016-03-11 14:31:06| Industrial Newsroom - All News for Today
Supporting Intel® 6th Generation Core™ i7/i5/i3 SoC processors, MB-73430 offers Type 6 pin-outs, 3 DDI channels and one LVDS channel. This basic-size COM Express module, which also incorporates Intel Gen9 HD Graphics with HEVC (H.265) support up to 32 GB dual-channel DDR4 memory, supports up to 3 independent displays as well as 8 PCIex1 Gen 3. Features enhance productivity in such areas as factory automation and counter- and cart-based medical applications.
RF-over-Fiber 12 Port Module Datasheet
2016-03-08 09:40:32| rfglobalnet Home Page
This RF-over-Fiber module is designed to convert analog RF signals into fiber signals, as well as convert fiber signals into RF signals. It covers a wide frequency range up to 6 GHz, is equipped with 12 ports, and features excellent stability, frequency jitter, and phase noise performance.
RF-over-Fiber 6 Port Module Datasheet
2016-03-08 09:37:26| rfglobalnet Home Page
This RF-over-Fiber module is designed to convert analog RF signals into fiber signals, as well as convert fiber signals into RF signals. It covers a wide frequency range up to 6 GHz, is equipped with 6 ports, and features excellent stability, frequency jitter, and phase noise performance.
Panasonic crystalline Si-based photovoltaic module achieves record energy conversion efficiency of 23.8% at research level
2016-03-03 21:56:19| Green Car Congress
Tags: level
research
record
energy
Wireless Communication Module is Bluetooth SMART compatible.
2016-03-01 14:31:04| Industrial Newsroom - All News for Today
Featuring Bluetooth® SIG certification, MK71050-03 integrates LAPIS Semiconductor's ML7105 wireless communication IC with 16 kB EEPROM, 26 MHz XO for master clock, and pattern antenna. Connection with host MCU is made via SPI, while commands and data format unique to LAPIS Semiconductor are implemented using 3 dedicated terminals: IRQ pin, WAKEUP pin, RF Active pin. Design has FCC certification in USA, construction design certification in Japan, and European compliance with R&TTE Directive.
Tags: communication
wireless
smart
compatible
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