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Bluetooth v4.0 Module has dual-mode stack, 300 m range.

2014-04-02 14:30:54| Industrial Newsroom - All News for Today

Bluetooth® Dual-mode (Bluetooth Smart Ready) System-on-Module OBP421 makes it is possible to get full control of all system resources in one solution and can also used as complete host CPU replacement. ARM®Cortex™-M3, 32-bit RISC core operates at 72 MHz with high-speed embedded memories consisting of Flash up to 384 kB and SRAM up to 64 kB. MCU offers range of I/O, peripherals, 12-bit ADCs, general-purpose 16-bit timers, PWM timers, as well as I²C, SPI, USART, and CAN interfaces. This story is related to the following:Bluetooth™ Modules

Tags: range module bluetooth stack

 

Michigan DEQ provides some clarification for citizen concerns about Sappi stack demolition

2014-03-17 13:46:21| Waste Management - Topix.net

No doubt when Michigan Department of Environmental Quality regulators appeared before a Muskegon Lake citizens group the issue of the planned April 27 Sappi demolition would arise.

Tags: concerns michigan citizen stack

 
 

Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using R&S CMW500 And Qualcomm Gobi 9x35 Chipset

2014-02-28 02:08:36| rfglobalnet News Articles

In a joint effort, Rohde & Schwarz and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35 chipset in compliance with 3GPP Release 10 for LTE-Advanced.

Tags: full carrier schwarz stack

 

LTE Protocol Stack targets small cell relay node backhaul.

2014-02-27 14:31:30| Industrial Newsroom - All News for Today

Designed for integration of relay node backhaul functionality with existing eNodeB solution, ALPS 521 provides interfaces to eNB network protocols via NextG-Com IPC framework, and is pre-integrated with eNB RN interfaces to scheduler and eNB controller entities. Release 11-compliant UE protocol stack is future-proof to support RN Layer 1 interfaces through adaptation layer, which supports both in-band without isolation and out-band/in-band with isolation RF architecture. This story is related to the following:Communications Protocols

Tags: small cell protocol targets

 

Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using ...

2014-02-27 06:00:00| Industrial Newsroom - All News for Today

Rohde & Schwarz and Qualcomm Technologies have successfully demonstrated the ability of the latest Qualcomm Gobi chipset to sustain full protocol stack data rates for LTE category 6 (Cat6). This milestone gives mobile operators a clear path to the commercial launch of LTE-Advanced carrier aggregation.  <br /> <br /> Munich &mdash; In a joint effort, Rohde & Schwarz and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), have extensively tested the ...This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Chip Sets |

Tags: full carrier schwarz stack

 

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