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Indium Corporation Features SACM(TM) High-Reliability Solder Paste at APEX
2014-02-25 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation will feature its new technology platform using SACM™ solder paste at APEX March 25-27 in Las Vegas, Nevada.<br /> <br /> SACM™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACM™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more ...This story is related to the following:Solder Paste
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Copper Paste System targets power electronic applications.
2014-02-18 14:33:37| Industrial Newsroom - All News for Today
Optimized for greater than 50 micron fired film thickness with one process cycle, Thick Print Copper Paste System can be used to create copper circuits from 20–350 microns thick on alumina and aluminum nitride substrates. As alternative to direct bonded copper products, thick print copper is electroless nickel, immersion gold plateable for soldering and wire-bonding assembly. RoHS-compliant system has proven superior thermal cycling performance over DBC by passing 1,000 cycles without failure. This story is related to the following:Copper Paste
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Solder Paste Stencil is available for custom stencil designs.
2014-02-11 14:31:55| Industrial Newsroom - All News for Today
Able to be applied to existing production stencils, chemistry of NanoSlic® Gold coating imparts hydrophobic and oleophobic surface to apertures and underside of stencil; non-stick surface resists solder paste build-up and reduces cleaning cycle requirements. Nano coating permanently bonds and conforms to aperture walls regardless of size or geometry. Abrasion surface withstands repeated cleaning, and paste release enables high-yield printing at low area SARs (surface area ratios). This story is related to the following:Paints and CoatingsSearch for suppliers of: Stencils | Coatings
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designs
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Pb-Free Solder Paste targets small, low-voltage QFN packages.
2014-02-10 14:32:06| Industrial Newsroom - All News for Today
Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. This story is related to the following:Solder Paste
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paste
Solder Paste Printer includes motion screen mechanism.
2014-02-06 14:30:13| Industrial Newsroom - All News for Today
Utilizing Motion Screen mechanism, Model RP-1 aligns PWB with screen mask. System drives 3 alignment modules attached to outer circumference of mask stage to adjust position in X, Y, and θ directions simultaneously. This allows repetitive printing accuracy of circumference fine adjustment to improve up to ±10 µm and duration time to be reduced to 6 sec. Automatic Solder Dispenser automatically supplies solders by measuring solder’s rolling diameter with sensor and adjusting volume accordingly. This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category SponsorSearch for suppliers of: Printed Circuit Board (PCB) Manufacturing Equipment
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printer
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