Home › 3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets
 

Keywords :   


3D IC and TSV Interconnect Market Worth $6.55 billion by 2016 - Report by MarketsandMarkets

2014-03-23 16:24:44| Semiconductors - Topix.net

March 23, 2014 According to a new market research report "Three-dimensional Integrated Circuit & Through-Silicon Via Interconnects Market - Global Forecast & Trend Analysis By Technology , Products & Applications ", the total 3D IC market is expected to reach $6.55 billion by 2016 at a CAGR of 16.9% from 2011 to 2016.

Tags: by report market worth

Category:Electronics and Electrical

Latest from this category

All news
»
05.11Vodafone-Three merger could get green light, watchdog says
05.11Altice USA residential video RGUs down 77,000 in 3Q 2024
05.11Shoppers warned over luxury advent calendar scams
05.11Durable Floor Coating from HMG Paints Transforms FC United\'s SMRE Bar
05.11Teknos Poland Honored by Farby i Lakiery
05.11Xumo teams up with Target to offer Hisense Xumo TVs
05.11KT launches 8K AI-powered IPTV set-top box
05.11Tropical Storm Rafael Graphics
More »