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BGA Socket accommodates 253-pin packages with 0.5 mm pitch.

2013-04-10 14:28:23| Industrial Newsroom - All News for Today

Designed for 0.5 mm pitch BGA 253 pin DDR4 with 8 x 13.5 mm package size, CG-BGA-5019 operates at up to 10 GHz with less than 1 dB insertion loss. Footprint lets inductors, resistors, and decoupling capacitors be placed within close proximity to device for impedance tuning. Along with double latch lid with integrated compression mechanism, features include elastomer contactor construction, 20 mΩ typ contact resistance (per pin), 0.11 nH pin self inductance, and 0.028 nH mutual inductance. This story is related to the following:Electronic Sockets | Ball Grid Array (BGA) Sockets | Ball Grid Arrays | Printed Circuit Boards (PCB)

Tags: packages pitch socket accommodates

Category:Industrial Goods and Services

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