Home Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips
 

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Microfluidics: DARPA is betting embedded water droplets could cool next-gen chips

2016-03-10 20:54:31| Extremetech

DARPA and Lockheed Martin have a plan to build microfluidic cooling into modern microprocessors. This could dramatically improve CPU cooling and break the bottleneck on clock speed scaling -- at least, for a little while.

Tags: water cool chips embedded

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