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Microporous Copper Foam suits heat sink applications.

2015-04-23 14:31:07| Industrial Newsroom - All News for Today

Featuring pore sizes from 300–600 µm and relative density of around 37%, Microporous Copper Foam is produced by means of lost carbonate sintering process. Rigid, highly porous, and permeable structure is regular and uniform throughout, and provides controlled density of metal per unit volume. Supplied in disks and sheet ranging in thickness from 4–10 mm, foam is suited for liquid cooling, air cooling, heat exchangers, EMI shielding, and power electronics applications.

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Category:Industrial Goods and Services

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