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Negative Photoresist offers chemical and moisture resistance.

2015-08-25 14:31:07| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3050 Dry-film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals. With glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C, DF-3050 is less brittle than most other negative photoresists.

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Category:Industrial Goods and Services

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