Home › Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
 

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Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications

2015-07-14 12:31:14| Industrial Newsroom - All News for Today

Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey  Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...

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