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TEM Sample Preparation System aids failure analysis labs.

2015-11-05 14:31:06| Industrial Newsroom - All News for Today

Available in FX and HX models, Helios™ G4 DualBeam Series offers 7 nm TEM lamella preparation solution for semiconductor manufacturing and failure analysis applications. Flexible FX system delivers STEM resolution down to sub-three Ångströms and enables images to be obtained within minutes of completing lamella. HX model, geared specifically for high-throughput TEM lamella production, features automated QuickFlip holder that minimizes sample preparation times.

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Category:Industrial Goods and Services

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