Home › Thermal Compound supports form-in-place gap filling.
 

Keywords :   


Thermal Compound supports form-in-place gap filling.

2015-09-30 14:31:07| Industrial Newsroom - All News for Today

Capable of filling large gaps around fragile circuit board solder points without causing damage or loss in performance, 5.0 W/m°K SARCON® SPG-50A facilitates efficient transfer of heat from any board-level source to nearby heat sink or heat spreader. Silicon based material provides optimized vibration absorption capabilities and maintains all initial properties across wide temperature range of -40 to +150°C. Compound is available in tubes or syringes.

Tags: supports gap thermal filling

Category:Industrial Goods and Services

Latest from this category

All news
15.06With Gratitude for a Job Well Done
Industrial Goods and Services »
17.06North American cattle trade: One of the most intertwined in the globe
17.06Software giant Adobe accused of 'trapping customers'
17.06Atlantic Tropical Weather Outlook
17.06Azelis Strengthens Footprint in South Africa Through Acquisition of CPS Chemicals (Coatings)
17.06Eastern North Pacific Tropical Weather Outlook
17.06Landa reports \'historic\' adoption of Nanography at drupa
17.06OMNI Systems opens Print Center of Excellence in Missouri
17.06Green energy plan 'won't benefit' Welsh valley residents
More »