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Thermal Interface Thin Film improves heatsink cooling performance.

2016-02-23 14:31:06| Industrial Newsroom - All News for Today

Available to electronic packaging engineers, Sarcon® YR-c delivers thermal conductivity of 4.0 W/m°K with thermal resistance of .08°Cin.²/W. V-0 rated thin film thermal interface product, when placed between heat source and nearby heatsink, eliminates near-microscopic air gaps between components. Suited for applications with -40 to +150°C operational range, product comes in 0.2, 0.3, and 0.45 mm thicknesses. Rolls are available up to 150 mm wide, or film can be die-cut to specifications.

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Category:Industrial Goods and Services

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