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Thin Film Metrology System targets 28 nm node and below.

2013-05-14 14:31:02| Industrial Newsroom - All News for Today

Available for transparent films in advanced semiconductor fabrication applications, S3000SX™ System uses focused beam ellipsometry and small site measurement optics to measure thickness of single- and multi-layer films on product wafers, including device area at site sizes as small as 30 x 30 µm. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow measurements, and next-generation airborne molecular contaminant control. This story is related to the following:Optics and PhotonicsMetrology Equipment | Metrology Instruments

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