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Water-Soluble Solder Paste minimizes voids.

2013-05-03 14:28:05| Industrial Newsroom - All News for Today

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesFlux Filled Solder | Flux | Solder | Solder Paste Dispensers |

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