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Additive Manufacturing Focus Day at Renishaw plc

2013-11-18 09:51:00| Renishaw News

Renishaw, the global engineering company, is collaborating with WEAF (West of England Aerospace Forum), to hold an Additive Manufacturing Focus Day, which will be held at Renishaw's New Mills headquarters in Gloucestershire on Thursday 28 November 2013.

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GE researchers developing a cold spray additive manufacturing technique

2013-11-08 16:30:24| Green Car Congress

Tags: cold technique developing manufacturing

 
 

Guidance Offered for Renewal of Feed Additive Authorisation

2013-10-24 02:00:00| ThePigSite - Industry News

EU - The European Food Safety Authority (EFSA) has published guidance for companies renewing authorisation for feed additives.

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DOE awards Georgia Tech team $600K to advance nanoscale additive manufacturing

2013-10-22 21:30:22| Green Car Congress

Tags: team tech advance awards

 

Additive for Copper Plating is suited for TSV filling.

2013-10-22 14:29:43| Industrial Newsroom - All News for Today

Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has been confirmed for range of via sizes, from 5–20 µm dia, and aspect ratios of 1 to 10. This story is related to the following:Additives

Tags: filling copper suited additive

 

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