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SMT Thin Film Chip Resistors are built on AlN substrates.
2014-08-04 14:31:27| Industrial Newsroom - All News for Today
Respectively offering 2 and 6 W power ratings in 1206 and 2512 case sizes, PCAN series provides ±25 ppm/°C TCR and laser-trimmed tolerances down to ±0.1% over -55 to +150°C range. Size of backside terminations on substrates reduce thermal resistance between topside resistor layer and solder joint on end-user's circuit assembly, increasing power handling capability. Resistance ranges from 30–175 Ω, noise is <-30 dB, voltage coefficients are 0.1 ppm/V, and voltage ratings range from 75–200 V. This story is related to the following:Surface Mount Resistors | Chip Resistors |
Thin Film Chip Resistor Arrays feature gold terminations.
2014-07-23 14:31:26| Industrial Newsroom - All News for Today
Offering 2 integrated resistors on one substrate, ACAS 0606 ATAU Resistor Arrays combine high-temperature operation to 155°C with relative tolerance down to ±0.05% and relative TCR down to ±5 ppm/K. Devices offer 2 equal or different resistance values from 100 Ω to 150 kΩ, with max resistance ratio of 1:20. Housed in 1.5 x 1.6 mm package, resistors feature 1,000 V ESD capability, 75 V operating voltage, and maximum rated dissipation to 0.125 W per element. This story is related to the following:Thin Film Resistors |
Ultrasonic Spot Welders work with foils as thin as 7 microns.
2014-07-21 14:31:04| Industrial Newsroom - All News for Today
Able to weld multiple layers and/or delicate foils to tabs or terminals, SonoWeld® 1600 and Dual Head Spot Welders also accommodate battery pouch assembly and HV termination welding. Durable bonds are created in one operation that takes seconds; does not employ any heat, current, fluxes, or filler; and does not produce any arcs, sparks, or fumes. Dual Head Spot Welder can join up to 100 layers of copper or aluminum foil in one pulse. Systems offer outputs of 1,500 and 2,500 W. This story is related to the following:Materials and Material ProcessingUltrasonic Welders | Bonding Machinery | Aluminum Welders
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ultrasonic
Additive Process Yields Consistent Substrate-Based Thin Film Circuits
2014-07-17 09:19:28| rfglobalnet Home Page
Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, recently announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits.
Tags: process
film
consistent
thin
Additive Process Yields Consistent Substrate-Based Thin Film Circuits
2014-07-17 09:19:28| wirelessdesignonline News Articles
Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, recently announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits.
Tags: process
film
consistent
thin
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