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Fujitsu Develops GaN Power Amplifier With World's Highest Output Performance For W-Band Wireless Transmissions
2016-01-26 04:54:42| rfglobalnet News Articles
Fujitsu Limited and Fujitsu Laboratories Ltd. (collectively "Fujitsu") recently announced the development of a gallium-nitride (GaN) high-electron mobility transistor (HEMT) power amplifier for use in W-band (75-110 GHz) transmissions. This can be used in a high-capacity wireless network with coverage over a radius of several kilometers.
Tags: power
performance
highest
wireless
Fujitsu Develops GaN Power Amplifier With World's Highest Output Performance For W-Band Wireless Transmissions
2016-01-26 04:54:42| wirelessdesignonline News Articles
Fujitsu Limited and Fujitsu Laboratories Ltd. (collectively "Fujitsu") recently announced the development of a gallium-nitride (GaN) high-electron mobility transistor (HEMT) power amplifier for use in W-band (75-110 GHz) transmissions. This can be used in a high-capacity wireless network with coverage over a radius of several kilometers.
Tags: power
performance
highest
wireless
Lightweight Design: ContiTech Develops World's First Polyamide Strut Mount for Passenger Car Chassis
2015-11-03 11:31:12| Industrial Newsroom - All News for Today
- Lightweight variant with fiberglass-reinforced polyamide 25 percent lighter than aluminum design - Enhanced ride comfort thanks to highly insulating rubber element AUBURN HILLS, Mich. - ContiTech Vibration Control - the strut mount specialist based in Hanover, Germany - has developed a strut mount in which...
Fujitsu Develops World's First Compact 300 GHz Receiver For Wireless Communications Of Tens Of Gigabits Per Second
2015-09-11 07:11:50| rfglobalnet News Articles
Fujitsu Limited and Fujitsu Laboratories Ltd. recently announced the development of the world's first 300 GHz band compact receiver capable of high-speed wireless communications at a rate of several tens of gigabits per second.
Tags: per
second
communications
wireless
Toshiba Develops World's First 256Gb, 48-Layer BiCS FLASH
2015-08-04 06:56:07| wirelessdesignonline News Articles
Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the new generation of BiCS FLASH™, a three-dimensional (3D) stacked cell structure flash memory.
Tags: flash
toshiba
worlds
develops