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Sheet Hydroforming Press offers cycle time under 30 seconds.

2015-06-03 14:31:05| Industrial Newsroom - All News for Today

With 20 in. diameter max blank size, 10 in. draw depth capacity, and integrated tool change system, 10,000 psi Triform Model 20-10-10BD allows manufacturers to form large parts within relatively small footprint. Precision diaphragm pressure and punch position control, combined with built-in recipe handling capability, offers optimized forming proficiency in intuitive package. With In-Sight feature, press can be paused and opened at any point in forming cycle to allow for visual inspection.

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ARM De-Risks Design Cycle For IoT Chips

2015-06-02 07:10:19| rfglobalnet Home Page

ARM has unveiled a new hardware subsystem to enable the fast and efficient development of highly customized chips for smart connected devices. The ARM IoT subsystem for ARM Cortex-M processors is optimized for use with ARM's most efficient processor and radio technologies, physical IP and ARM mbed OS.

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ARM De-Risks Design Cycle For IoT Chips

2015-06-02 07:10:19| wirelessdesignonline News Articles

ARM has unveiled a new hardware subsystem to enable the fast and efficient development of highly customized chips for smart connected devices. The ARM IoT subsystem for ARM Cortex-M processors is optimized for use with ARM's most efficient processor and radio technologies, physical IP and ARM mbed OS.

Tags: design cycle arm chips

 

Bhel wins Power Cycle Piping (PCP) package contract for 1980MW thermal power project in India

2015-06-01 01:00:00| Power Technology

National Thermal Power Corporation (NTPC) has awarded a contract to power manufacturer Bharat Heavy Electricals (Bhel) for supply and installation of the Power Cycle Piping (PCP) package for Stage-I of the Barh Super Thermal Power Project (STPP) in B

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High-Throughout Screen Printer offers 6 sec core cycle time.

2015-05-29 14:31:06| Industrial Newsroom - All News for Today

Equipped with dual syringe Advanced Dispense unit + (ADu+), SP710 supports precise deposition of solder paste, adhesive, and other materials. ADU+ also promotes smaller component deposition accuracy and affords flexibility with applications for stencil-less prototyping and on-the-fly engineering changes. Also included, SMarT-Cal product-based machine calibration maintains maximum process window to manage sophisticated application challenges.

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