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Tag: copper
Duke team develops new core-shell copper nanowire catalyst for efficient water oxidation for solar fuels
2013-10-25 18:30:25| Green Car Congress
Tags: team
water
efficient
copper
All-graphene computer chip could steer us past the 22nm copper and silicon bottleneck
2013-10-25 18:13:47| Extremetech
The copper wires in computer chips can only get so thin before the increased resistance and other manufacturing issues make them unworkable. Graphene, however, by virtue of its status as a wonder material, isn't hindered by the same puny restrictions as copper and could theoretically scale down to just a handful of nanometers or less, allowing for the creation of computer chips that are orders of magnitude more dense and powerful, while consuming less energy.
Tags: computer
past
chip
copper
Copper Backhaul Bonding delivers 100 Mbps over 1 mile.
2013-10-25 14:32:25| Industrial Newsroom - All News for Today
As bonding solution for fixed and mobile backhaul networks, mBond™ offers telecommunications operators alternative to fiber and microwave for increasing copper backhaul bandwidth. Solution can deliver 100 Mbps over 1 mile, effectively aggregating available bandwidth per pair. Any number of pairs can be bonded, and when more bandwidth is required, bonded pairs may be grouped. With this product, mobile telecommunications operators can enhance capacity of copper-wired base stations. This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Network Hardware |
Tags: mile
delivers
copper
bonding
Surveillance video released of copper thefts at Harley Davidson in Menomonee Falls
2013-10-24 07:39:43| Automakers - Topix.net
CAUGHT ON CAMERA. STEALING THOUSANDS OF DOLLARS OF COPPER FROM A HARLEY DAVIDSON PLANT.
Tags: video
released
falls
copper
Additive for Copper Plating is suited for TSV filling.
2013-10-22 14:29:43| Industrial Newsroom - All News for Today
Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has been confirmed for range of via sizes, from 5–20 µm dia, and aspect ratios of 1 to 10. This story is related to the following:Additives
Tags: filling
copper
suited
additive
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