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Wolfspeed Has Shipped GaN RF Devices Surpassing 1.3 Gigawatts Output Power While Achieving Industry-Leading Reliability
2016-03-08 11:31:12| Industrial Newsroom - All News for Today
Durham, N.C. - Wolfspeed, A Cree Company, announced that as of the end of 2015, it shipped GaN-on-SiC RF power transistors with a combined RF output power of more than 1.3 gigawatts. Wolfspeed achieved this milestone while maintaining a failure-in-time rate (FIT rate) of 5-per-billion device hours, illustrating the...
Tags: power
output
devices
reliability
Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices
2016-01-14 05:41:49| rfglobalnet Home Page
Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1
Tags: form
provide
mobile
solutions
Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices
2016-01-14 05:41:49| wirelessdesignonline News Articles
Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1
Tags: form
provide
mobile
solutions
Qualcomm and TDK Form Joint Venture to Provide Industry-Leading RF...
2016-01-13 12:49:34| Wireless - Topix.net
Ltd. [1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.
Qualcomm and TDK Form Joint Venture to Provide Industry-Leading RF...
2016-01-13 11:59:41| Semiconductors - Topix.net
Ltd. [1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.
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