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Wolfspeed Has Shipped GaN RF Devices Surpassing 1.3 Gigawatts Output Power While Achieving Industry-Leading Reliability

2016-03-08 11:31:12| Industrial Newsroom - All News for Today

Durham, N.C. - Wolfspeed, A Cree Company, announced that as of the end of 2015, it shipped GaN-on-SiC RF power transistors with a combined RF output power of more than 1.3 gigawatts. Wolfspeed achieved this milestone while maintaining a failure-in-time rate (FIT rate) of 5-per-billion device hours, illustrating the...

Tags: power output devices reliability

 

Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices

2016-01-14 05:41:49| rfglobalnet Home Page

Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1

Tags: form provide mobile solutions

 
 

Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices

2016-01-14 05:41:49| wirelessdesignonline News Articles

Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1

Tags: form provide mobile solutions

 

Qualcomm and TDK Form Joint Venture to Provide Industry-Leading RF...

2016-01-13 12:49:34| Wireless - Topix.net

Ltd. [1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

Tags: form provide joint rf

 

Qualcomm and TDK Form Joint Venture to Provide Industry-Leading RF...

2016-01-13 11:59:41| Semiconductors - Topix.net

Ltd. [1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

Tags: form provide joint rf

 

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