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Tag: profiles
Explore the importance of soil profiles
2016-12-01 10:00:00| Corn & Soybean Digest
SPONSORED Soil types vary across the country, and The Mosaic Company explains how one product can be tailored to meet the needs of different soil conditions. read more
Tags: importance
explore
profiles
soil
Dutch Mobile Virtual Operators 2016 Q1 - All Profiles
2016-07-19 18:05:49| Telecompaper Reports
In this document you will find all the company profiles written for the report 'Dutch Mobile Virtual Operators 2016 Q1'. We have produced company profiles on most of the virtual players covered in this report. The mentioned report covers the development of the virtual operator market in the Netherlands as of the first quarter of 2016, for more information see following link. Each profile is available separately too (upon request, email to sales@telecompaper.com), but this combined document offers a discount compared to buying them all separately
Tags: mobile
virtual
profiles
dutch
P2 Forecast promises probabilistic production profiles
2016-07-06 20:00:00| Oil IT Journal - www.oilit.com
New solution embeds 'BZ' physics-based analytics machine from BetaZi.
Tags: production
profiles
forecast
promises
LIA Profiles New President and Board of Directors.
2016-03-29 14:31:08| Industrial Newsroom - All News for Today
LIA announced Lin Li as 2016 President, Paul Denney as President-Elect, Stephen Capp as Treasurer, Milan Brandt as Secretary, and Robert Thomas as Immediate Past President. Those serving on LIA's Board of Directors from 2016–2018 will be Clive Grafton-Reed, John Hunter, Stefan Kaierle, Yongfeng Lu, Eric Mottay, Robert Mueller, Andreas Ostendorf, Rajesh S. Patel, Silke Pflueger, and Koji Sugioka.
Tags: of
board
president
profiles
PCBs with Cavities can thin electronic device profiles.
2016-01-27 14:31:04| Industrial Newsroom - All News for Today
Meeting electronic device thermal management and miniaturization demands, Cavity PCBs have structural recesses that enable additional functions. Cavities allow positioning of electronic components to give assembled PCB thinner structure. Applied to multilayer PCBs, process allows variations and layouts with several cavities and different depths (if desired) on one circuit board. Cavities can be made using Controlled Depth Routing, sequential lamination with low- or no-flow prepregs, or laser.
Tags: electronic
device
profiles
thin
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