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Future Electronics Promotes EPCOS PTC Thermistors from TDK

2016-02-12 11:31:09| Industrial Newsroom - All News for Today

Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of EPCOS PTC thermistors from TDK, offering superior solutions for circuit protection. PTC (Positive Temperature Coefficient) thermistors are able to offer more reliable...

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Qualcomm, TDK Join Forces in $3 Billion Radio-Chip Venture

2016-01-14 08:43:29| Semiconductors - Topix.net

Qualcomm Inc., the biggest maker of chips that run smartphones, is teaming up with Japan's TDK Corp. to create a Singapore-based joint venture that will make components for the growing market for radio-frequency chips used in handsets, robotics, cars and drones. TDK surged.

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Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices

2016-01-14 05:41:49| rfglobalnet Home Page

Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1

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Qualcomm And TDK Form Joint Venture To Provide Industry-Leading RF Front-End Solutions For Mobile Devices

2016-01-14 05:41:49| wirelessdesignonline News Articles

Qualcomm Incorporatedand TDK Corporation recently announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)1

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Qualcomm and TDK Form Joint Venture to Provide Industry-Leading RF...

2016-01-13 12:49:34| Wireless - Topix.net

Ltd. [1]. The joint venture will draw upon TDK's capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm's[2] expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

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