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High-Temperature Resistor suits applications to +200°C.
2014-02-04 14:31:02| Industrial Newsroom - All News for Today
Designed to operate in harsh environments, Model Z201HT offers TCR of ±1 ppm/°C nominal from -55 to +200°C, tolerances to ±0.01%, and load-life stability to 0.1% after 1,000 hr of rated power at +200°C. Through-hole Z-Foil resistor features resistance range of 10 Ω to 100 kΩ and rise time of 1 ns with effectively no ringing. Capable of withstanding ESD of at least 25 kV, RoHS-compliant device is suited for geothermal measuring equipment, turbine engine control, and environmental test chambers. This story is related to the following:High Temperature Resistors | Precision Resistors
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hightemperature
Silver-Filled Epoxy Adhesive suits applications up to 480°F.
2014-01-31 14:31:50| Industrial Newsroom - All News for Today
Formulated using high purity silver flake, Aremco-Bond™ 556-HTHC is used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical/electronic assembly applications. Two-part, electrically and thermally conductive adhesive exhibits low volume resistivity of less than 0.0001 Ω-cm at room temperature and thermal conductivity of 2.2 W/m-°K. Product offers tensile shear strength of 1,700 psi, Shore D hardness of 90, and viscosity range of 40,000–45,000 cP. This story is related to the following:Epoxies | Electrically Conductive Adhesives
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epoxy
Epoxy Adhesive suits microelectronic assembly applications.
2014-01-14 14:30:45| Industrial Newsroom - All News for Today
Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. This story is related to the following:Epoxy Adhesives
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assembly
suits
adhesive
Horizontal Machining Center suits large part applications.
2014-01-14 14:30:45| Industrial Newsroom - All News for Today
Suitable for industrial component manufacturing and aerospace job-shop environments where machining of soft and hard metals is required, T1 5-Axis HMC can machine workpieces up to 3.2 ft² x 19.6–31.4 in. high in single 5-sided process. System provides X, Y, Z travels of 59.1, 51.2, 78.7 in. respectively. B-axis rotary table offers 360° rotational speed of 3,600 deg/min, which is supported by 10,000 Nm of continuous torque. Spindle's continuous power of 56 kW is maintained from 1,000–12,000 rpm. This story is related to the following:Large Capacity Machining Centers | 5 Axis Machining Centers
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center
large
applications
Round Fine Centering System suits mold making applications.
2014-01-14 14:30:45| Industrial Newsroom - All News for Today
Heat resistant up to 302°F, Round Fine Centering System provides accurate backlash-free mold alignment, accurate radial bearing side lock, and high initial load capacity. Design allows for pre-centering of mold halves for gentle and synchronous close so injection molded parts are removed without damage. Since system is not limited to 4 corners of mold, mold maker can place unit where there will be more deflection, providing rigidity, optimized open and closure, and minimal wear. This story is related to the following:Test and Measuring InstrumentsCentering Machinery | Mold Making Machinery
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