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Tag: applications
Quad 2525 Case Size SMD MLCC suits high-frequency RF applications.
2014-06-03 14:30:56| Industrial Newsroom - All News for Today
Manufactured in noble metal electrode (NME) technology with wet build process, the QUAD HIFREQ 2525 is based on stable ceramic dielectric and features Q of >4,000 at 10 MHz, 1 pF; ESR down to 0.018 Ω; and DC voltage ratings up to 3,600 V. Other characteristics include 1.0–2,700 pF capacitance range, tight tolerances to ±0.1 pF, aging rate of 0% per decade, and 55 to 125°C operating range. Supporting working voltages from 300–3,600 V, halogen-free MLCC is available with choice of terminations. This story is related to the following:Multilayer Ceramic Chip Capacitors | Chip Capacitors | Capacitors |
Tags: size
case
applications
suits
Dual-Core MCUs suit functional safety applications.
2014-06-03 14:30:55| Industrial Newsroom - All News for Today
Based on 32-bit lockstep ARM® Cortex®-R5 cores in cached memory architecture, Hercules™ RM57Lx and TMS570LCx support speeds up to 330 MHz, delivering 550 peak DMIPS, 660 peak MIPS, and up to 330 MFLOPS. RM57Lx models help developers meet IEC 61508 functional safety standards, while TMS570LCx MCUs help meet ISO 26262 functional safety standard. Floating point devices support up to 4 MB of integrated program Flash, 512 KB of on-chip RAM, and 128 KB of data Flash for EEPROM emulation. This story is related to the following:Electronic Components and Devices Sponsored by: Globtek Inc. - Your Power Partner...For Over 20 Years!Flash Memories | Modem Chips |
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safety
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functional
Multi-Core Processor enhances 3D imaging and CV applications.
2014-06-03 14:30:55| Industrial Newsroom - All News for Today
Leveraging multi-core architecture comprising 3D image processor, dual CEVA-MM3101 Vector DSPs, and ARM® Cortex® A5 processor with ARM NEON®, NU3000 ASIC delivers performance and accuracy needed for such applications as 3D imaging, Natural User Interface, and 3D vision for PCs, laptops, tablets, smartphones, and other consumer devices. Flexible architecture allows use of same NU3000 ASIC to support different operational ranges for various 3D imaging and Computer Vision (CV) applications. This story is related to the following:Image Processors
Tags: applications
cv
processor
imaging
API Urges Rapid Approval For LNG Export Applications
2014-06-03 11:33:52| oilandgasonline Home Page
API Director of Upstream and Industry Operations Erik Milito urged faster action after the Department of Energy announced new procedures to process over 20 applications to export liquefied natural gas (LNG).
Tags: applications
export
approval
rapid
USB3.0 Connectors accommodate height-restrictive applications.
2014-06-02 14:31:02| Industrial Newsroom - All News for Today
USB3.0 mid reverse connectors are designed for inclusion in such devices as tablets, notepads, and other handheld devices. Mid bottom mount USB3.0 connectors are available for low-profile applications where height above and below PCB is critical. Allow mounting on bottom of PCB, reverse connectors sit in cut out on PCB to minimize height. With cutaway face, USB1115 has .212 in. body height and suits angled panels. While USB1110 is mounted below PCB, bulk sits above PCB. This story is related to the following:ServicesSearch for suppliers of: USB Systems Integrators |
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accommodate
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connectors accommodate
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