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Qualcomm Dumps Package In First CMOS PA Offering

2014-08-01 07:54:09| rfglobalnet Home Page

The highly promoted RF PA devices from Qualcomm are starting to hit production phones. The first phone built with the Qualcomm PAs utilizes both the QFE2320 (for low-band) and QFE2340 (for high-band) multi-mode/multi-band (MMMB) PAs.

Tags: pa package offering cmos

 

Alstom to supply equipment and maintenance package for Monterrey III power plant

2014-07-30 01:00:00| Power Technology

Alstom has received contracts to supply a power island (KA24) for Iberdrolas Monterrey III combined-cycle power plant in Pesqueria, Nuevo Leon, Mexico.

Tags: power iii equipment supply

 
 

Web Guide Controller (24 Vdc) comes in compact package.

2014-07-29 14:33:34| Industrial Newsroom - All News for Today

Compatible with existing AccuWeb web guide systems, EVO 150 features 150 W of power and can control brushed and brushless actuator motors. Control module, measuring 6.5 x 4.5 x 1.5 in., features EtherNet/IP communication protocol for uploading and downloading of guide system settings and performance parameters. Product can be mounted in EVO enclosure measuring 7 x 5 x 4 in., including one with flush-mounted, switch-pad HMI panel on face, or din-mounted in existing control panel.<br /> This story is related to the following:Mechanical Components and AssembliesWeb Guiding Machinery | Guides | Web Controls

Tags: web guide package compact

 

DDL West Expands Its Medical Device Package Testing Capacity

2014-07-25 06:00:00| Industrial Newsroom - All News for Today

Fountain Valley, CA &ndash; <a href="http://www.testedandproven.com/">http://www.testedandproven.com/</a> -- DDL Inc. announced today it has expanded capacity for medical device testing at its DDL West laboratory in Fountain Valley, CA.<br /> <br /> The expansion includes the addition of a new building that provides increased capacity for environmental conditioning, real time aging and accelerated aging testing. This additional capacity gives DDL West the capability to better meet the growing ...

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Inventor's lawsuit against Heinz over Dip & Squeeze package revived

2014-07-23 19:15:51| Food - Topix.net

The Dip & Squeeze is the first ketchup packet with dual functionality, meaning users can tear off the top to squeeze or peel back the lid to dip.

Tags: package dip inventors heinz

 

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