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Surface-Mount Aluminum Capacitors operate up to 150°C.
2013-02-15 14:37:31| Industrial Newsroom - All News for Today
Available in 6 case sizes ranging from 12.5 x 12.5 x 13 mm to 18 x 18 x 21 mm, 160 CLA Series is designed to meet IPC/JEDEC J-STD-020 soldering guidelines for severe reflow conditions. Polarized aluminum electrolytic capacitors feature max impedance of 0.035 Ω at 100 kHz, ripple current to 1.35 A, and useful life of 2,000 hr at +150°C. Designed with non-solid, self-healing electrolyte, AEC-Q200-qualified units offer capacitance from 100–3300 µF over 16–50 V range. This story is related to the following:Surface Mount Capacitors | Aluminum Electrolytic Capacitors
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aluminum
capacitors
surfacemount
Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2013-02-13 12:26:28| electronicsweb Downloads
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
Tags: series
heat
stick
aluminum
Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2013-02-13 12:26:28| rfglobalnet Downloads
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
Tags: series
heat
stick
aluminum
Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2013-02-13 12:26:28| dairynetwork Downloads
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
Tags: series
heat
stick
aluminum
Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series
2013-02-13 12:25:14| electronicsweb Downloads
The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).
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