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Intersil's 'DAQ on a Stick' Provides Complete Thermocouple and Strain ...

2013-02-23 00:18:22| Semiconductors - Topix.net

MILPITAS, CA, Feb 22, 2013 -- Intersil Corporation , a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors, will demonstrate new thermocouple and strain gauge designs using a convenient "DAQ on a Stick" at Embedded World 2013.

Tags: complete stick strain thermocouple

 

Intersil's 'DAQ on a Stick' Provides Complete Thermocouple and Strain ...

2013-02-23 00:08:32| Electronics - Topix.net

MILPITAS, CA, Feb 22, 2013 -- Intersil Corporation , a leader in the design and manufacture of high-performance analog, mixed-signal and power management semiconductors, will demonstrate new thermocouple and strain gauge designs using a convenient "DAQ on a Stick" at Embedded World 2013.

Tags: complete stick strain thermocouple

 
 

Stick a fork in it: The American meat industry is ripe for a restart

2013-02-20 12:52:00| Climate Ark Climate Change & Global Warming Newsfeed

Grist: Weve heard it 38,942,038,417 times* before: The system we use to produce meat in the U.S. is really eff-ed up. Feedlots = horror movies, all this carnivory is making us fat, and to make matters worse, meat consumption contributes to climate change. Right, all good arguments for eating less meat. What we rarely hear is a fair, honest conversation with the actual farmers raising the animals that produce the meat that most of America consumes. Thats what Graham Meriwether wanted to do with his...

Tags: american industry stick meat

 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| electronicsweb Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| rfglobalnet Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

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