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Thin Film Flat Chip Resistors operate up to 1,000 V.

2015-06-18 14:31:05| Industrial Newsroom - All News for Today

Available in 1206 and 1210 case sizes, TNPV e3 Series covers resistance range from 121 kΩ to 3.01 MΩ. Devices feature low VCR of <1 ppm/V, tight tolerances to ±0.1%, and low TCR down to ±10 ppm/K. Operating over temperature range of -55 to +125°C, resistors offer dissipation to 0.33 W at ambient temperature of 70°C. RoHS-compliant units are extremely stable in various environmental conditions, as confirmed by load-life stability of ≤ ± 0.05 % for 1,000 hr at rated power and +70°C.

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Nova Chemicals commissions new Brampton Engineering nine-layer blown film co-extrusion line

2015-06-17 02:54:49| Canadian Plastics Headlines

Equipment enhances customer collaboration, product and applications development capabilities, company says. The post Nova Chemicals commissions new Brampton Engineering nine-layer blown film co-extrusion line appeared first on Canadian Plastics.

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S+P Samson selects Radel PPSU film Structobond labels\' inlay

2015-06-16 07:00:00| Label and Narrow Web Breaking News

The medical device labels address the growing need for improved identification and management of surgical instruments.

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Vimond to provide managed cloud OTT TV for Nordisk Film brands

2015-06-15 12:00:04| Digital TV News

Vimond Media Solutions has announced a collaboration with Nordisk Film. As part of the agreement, Vimond will provide an end-to-end managed cloud OTT-TV and video streaming service for Nordisk Film brands such as minbio.dk and Dansk Film Skat.

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Butler Automatic SP1 Automatic Film Splicer Reduces Downtime in Food and Beverage Packaging

2015-06-10 12:31:09| Industrial Newsroom - All News for Today

Splicer performs non-stop film changes in food and beverage packaging operations Middleborough, MA Butler Automatic, the inventor and global leader of automatic splicing solutions, announces that its SP1 Series Automatic Film Splicer is ideally suited towards food and beverage packaging applications. The SP1...

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