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EPDM Rubber Compound is 45% bio-renewable.

2015-04-27 14:31:07| Industrial Newsroom - All News for Today

Made from polymer produced from sugarcane-based feedstock, EPDM Rubber Compound is capable of withstanding temperatures up to 150°C and has optimized compressive stress force retention. Sugarcane base allows material to be 45% bio-renewable, which ultimately reduces manufacturing carbon footprint. Applications include seals for coolants, steam, synthetic hydraulic fluids, brake fluids, and aerospace hydraulic fluids.

Tags: rubber compound epdm epdm rubber

Use of the New MicroCal PEAQ-ITC System for Measurement and Characterisation of Protein-LMW Compound Interactions

2015-04-07 17:35:00| Food Processing Technology

Isothermal titration calorimetry (ITC) directly measures heat released or absorbed in a binding event, providing means for studying protein-small molecule interactions in solution without the need for labelling or immobilisation.

Tags: of system measurement interactions

Epoxy Potting Compound resists high temperatures.

2015-03-27 13:31:09| Industrial Newsroom - All News for Today

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils, insulators, and sensors.

Tags: high compound temperatures epoxy

Epoxy Potting Compound suits applications to 365°F.

2015-03-27 13:31:09| Industrial Newsroom - All News for Today

Offering thermal conductivity, electrical insulation, and low shrinkage after cure, Aremco-Bond™ 2315 is suited for potting and encapsulating densely packaged power supplies, rectifiers, ICs, oscillators, DACs, amplifiers, and relays. Black-pigmented product provides flexural strength of 12,300 psi and dielectric strength of 480 V/mil. Mixed in ratio of 100 parts resin to 25 parts hardener by weight, compound cures in 2 hr at 160°F plus 2 hr at 300°F.

Tags: applications compound suits epoxy