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DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) For 802.11ac Access Points Using TSMC Standard CMOS Process

2016-01-08 05:17:54| wirelessdesignonline News Articles

DSP Group®, Inc. (NASDAQ: DSPG), announced the launch of SparkPA– a revolutionary RF Power Amplifier (PA) for the high performance and technically challenging 802.11ac Access Point market, using a standard CMOS Process from TSMC (TWSE: 2330, NYSE: TSM).

Tags: group power access process

 

Celeno Adopts CEVA DSP for High Performance 802.11ac Wave 2 4x4 Products

2016-01-07 11:31:08| Industrial Newsroom - All News for Today

CEVA-XC DSP delivers powerful, highly integrated solution for Celenos Wave 2 4x4 silicon MOUNTAIN VIEW, Calif.  - CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, announced today that Celeno Communications has licensed and deployed the CEVA-XC DSP...

Tags: high products performance wave

 
 

Celeno Adopts CEVA DSP For High Performance 802.11ac Wave 2 4x4 Products

2016-01-05 07:36:16| wirelessdesignonline News Articles

CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP and IP platforms for cellular, multimedia and connectivity, announced today that Celeno Communications has licensed and deployed the CEVA-XC DSP for its 802.11ac Wave 2 4x4 Wi-Fi chip portfolio.

Tags: high products performance wave

 

Celeno Adopts Ceva DSP for High Performance 802.11ac Wave 2 4x4 Products

2016-01-05 07:07:48| Wireless - Topix.net

Celeno has utilized the CEVA-XC to build a powerful, flexible and highly efficient solution for Wi-Fi 802.11ac next generation access points and client devices. Celeno is a leader in video-grade Wi-Fi and other demanding multimedia and data home networking applications.

Tags: high products performance wave

 

OpenVPX DSP Modules leverage Intel Xeon D-1500 CPUs.

2015-11-12 14:31:04| Industrial Newsroom - All News for Today

Available with 8-core versions of Intel® Xeon® D-1500 CPUs and supporting forthcoming 12- and 16-core versions, 3U CHAMP-XD1 and 6U CHAMP-XD2 are designed for compute-intensive EW/C4ISR aerospace and defense applications. Rugged open architecture modules offer XMC card expansion and feature DDR4 memory and PCIe Gen 3 data paths on both data and expansion planes. While XD1 module supports combination of 1 Gigabit and 10 Gigabit Ethernet (GbE) interfaces, XD2 adds support for 40 GbE.

Tags: modules intel dsp leverage

 

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