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Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| electronicsweb Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| rfglobalnet Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 
 

Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series

2013-02-13 12:26:28| dairynetwork Downloads

The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

Tags: series heat stick aluminum

 

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