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Tag: semiconductors
NXP Semiconductors to Present at Upcoming Investor Conferences
2015-05-14 19:55:21| Semiconductors - Topix.net
EINDHOVEN, Netherlands, May 14, 2015 -- NXP Semiconductors N.V. today announced participation in the following upcoming events with the financial community: Interested parties can listen to a live audio webcast of the presentation portion of the events, as available on NXP's website, www.nxp.com/investor . A replay of each webcast will be made available within 24 hours of the presentation.
Tags: present
upcoming
investor
conferences
"Semiconductors in the United Kingdom" now available at Fast Market Research
2015-05-09 17:21:44| Semiconductors - Topix.net
The profile also contains descriptions of the leading players including key financial metrics and analysis of competitive pressures within the market. Essential resource for top-line data and analysis covering the United Kingdom semiconductors market.
Tags: united
research
fast
market
Analyst: Intel will adopt quantum wells, III-V semiconductors at 10nm node
2015-04-23 15:35:33| Extremetech
Could Intel be planning a double whammy at 10nm? One analyst argues yes, and bets Intel will debut new semiconductor materials at that node -- as well as new techniques for manufacturing transistors.
Tags: intel
adopt
wells
analyst
Organic Semiconductors Will Create Cheaper, Greener Devices
2015-04-13 07:32:38| electronicsweb Home Page
Semiconductors are used in devices such as LED TVs to convert electric current to light; and in photovoltaic cells, which absorb light energy and convert it into electricity.
Tags: create
devices
organic
cheaper
GaN Power Semiconductors simplify PCB design with topside cooling.
2015-03-24 13:31:07| Industrial Newsroom - All News for Today
With current ratings from 8–250 A, gallium nitride (GaN) power transistors feature GaNPX™ packaging and are based on Island Technology®. Die consist of islands and is embedded within laminate construction. Series of galvanic processes replace conventional techniques, such as clips, wire bonds, and molding compounds. While packaged to be cooled via topside of chip using heat sink or fan, products can also be cooled from bottom surface of die through conduction to PCB.
Tags: design
power
cooling
simplify
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