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NXP Semiconductors to Present at Upcoming Investor Conferences

2015-05-14 19:55:21| Semiconductors - Topix.net

EINDHOVEN, Netherlands, May 14, 2015 -- NXP Semiconductors N.V. today announced participation in the following upcoming events with the financial community: Interested parties can listen to a live audio webcast of the presentation portion of the events, as available on NXP's website, www.nxp.com/investor . A replay of each webcast will be made available within 24 hours of the presentation.

Tags: present upcoming investor conferences

 

"Semiconductors in the United Kingdom" now available at Fast Market Research

2015-05-09 17:21:44| Semiconductors - Topix.net

The profile also contains descriptions of the leading players including key financial metrics and analysis of competitive pressures within the market. Essential resource for top-line data and analysis covering the United Kingdom semiconductors market.

Tags: united research fast market

 
 

Analyst: Intel will adopt quantum wells, III-V semiconductors at 10nm node

2015-04-23 15:35:33| Extremetech

Could Intel be planning a double whammy at 10nm? One analyst argues yes, and bets Intel will debut new semiconductor materials at that node -- as well as new techniques for manufacturing transistors.

Tags: intel adopt wells analyst

 

Organic Semiconductors Will Create Cheaper, Greener Devices

2015-04-13 07:32:38| electronicsweb Home Page

Semiconductors are used in devices such as LED TVs to convert electric current to light; and in photovoltaic cells, which absorb light energy and convert it into electricity.

Tags: create devices organic cheaper

 

GaN Power Semiconductors simplify PCB design with topside cooling.

2015-03-24 13:31:07| Industrial Newsroom - All News for Today

With current ratings from 8–250 A, gallium nitride (GaN) power transistors feature GaNPX™ packaging and are based on Island Technology®. Die consist of islands and is embedded within laminate construction. Series of galvanic processes replace conventional techniques, such as clips, wire bonds, and molding compounds. While packaged to be cooled via topside of chip using heat sink or fan, products can also be cooled from bottom surface of die through conduction to PCB.

Tags: design power cooling simplify

 

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