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Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications

2014-02-18 06:00:00| Industrial Newsroom - All News for Today

Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures.<br /> <br /> With a Shore D hardness exceeding 95, EP21SC-1 is a rigid compound that adheres well to treated metals, ceramics ...This story is related to the following:Paints and CoatingsSearch for suppliers of: Sealants | Epoxies | Thermally Conductive Coatings | Coatings | Adhesives

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Plural Component Sprayer handles foam and polyurea.

2014-02-07 14:30:49| Industrial Newsroom - All News for Today

Supplied in electric stand-alone models and integrated systems, Reactor® 2 combines software and hardware advancements that help contractors apply materials accurately. Unit includes inlet pressure and temperature sensor, Xtreme-Wrap&trade; Scuff Guard on heated hoses, and Advanced Display Module that provides chemical recipe storage, drum level indicators, and on-screen troubleshooting. With Graco InSite technology, owners can see real-time jobsite data via smartphone, tablet, or computer. This story is related to the following:Foam Sprayers

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Component Engineer

2014-02-04 12:38:20| Space-careers.com Jobs RSS

HE Space is a successful international space company. For over 30 years, we have been supporting our customers with qualified experts in the field of engineering, science and administration. We are currently looking for a Component Engineer to support our customer in the Netherlands. Component Engineer Key Tasks and Responsibilities In this role you will be working in the components laboratory at ESAESTEC. You will have the following responsibilities Provide expertise in some of the following Passive Components, Discrete Semiconductors for RF and nonRF, Complex Microcircuits for Digital, Analog, Mixed Signal and Microwave, Hybrid Technology, Micropackaging, Optoelectronics and MicroNanoSystems Carry out Failure Analysis tasks and prepare reports on analysis tasks Support and advice concerning the performance of analysis tasks subcontracted to external laboratories Provide related technical support on EEE components to ESA projects and other DTEC divisions in the area of hybrid technology Provide technical assistance in the definition and management of ESA technology programmes in the field of hybrid technology Skills Experience You will have the following qualifications and relevant experience University degree in electrical engineering, physics or related specialisation Several years of relevant experience Demonstrated background and experience in EEE component technologies Proficiency in SEM and FIB techniques as well as expertise in general laboratory practices Metallurgical background would be an asset Knowledge of xray tomography would be an asset Fluency in English is mandatory knowledge of another European language is an advantage. This job is located in Noordwijk. We are looking for candidates who are available from April 2014 or as soon as possible thereafter. If you think you have what it takes for this job, please send us your CV together with a letter of motivation both in English and in Word to Ms Julia Niehaus, quoting job reference NLSC2187 before 24Feb14. An exciting and dynamic international working environment awaits you! Apply for this job

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Modular SMT Component Mounter offers operational flexibility.

2014-02-03 14:31:27| Industrial Newsroom - All News for Today

With LNC120 LaserAlign® module and Placement Monitor (EPV) function, RX-6 features max placement speed of up to 26,000 cph (IPC985); RX-7 Ultra-High-Speed Placer enables max placement speed of 60,000 cph (IPC9850). While 6-nozzle head supports components from 01005 up to 33.5 x 33.5 x 33 mm, 3-nozzle head supports components from 01005 chips up to 100 x 100 mm or 50 x 180 mm connectors up to 33 mm high. Standard unit handles PCBs up to 610 x 590 mm (905 x 590 mm with long board option). This story is related to the following:Surface Mount Technology Placement Systems |

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Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and ...

2014-01-27 06:00:00| Industrial Newsroom - All News for Today

Non-Drip, One Component Silicone Offers High Temperature Resistance, Thermal Conductivity and Electrical Isolation<br /> <br /> Placing an emphasis on convenient handling, Master Bond MasterSil 705TC features a paste consistency that doesn't require mixing. This single component system sets up in 7 minutes and has a non-corrosive cure at room temperature when exposed to atmospheric humidity.<br /> <br /> Suitable for a variety of bonding, sealing and coating applications, MasterSil 705TC ...This story is related to the following:Adhesives and SealantsSilicone Adhesives | Electrically Conductive Adhesives |

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