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Vodafone promotes LTE, NFC with new white-label smartphones
2014-07-11 13:59:00| Telecompaper Headlines
(Telecompaper) Vodafone has brought out an entry-level LTE smartphone called the Vodafone Smart 4 Power. It has a 5-inch screen with a resolution of 960 x 540 pixels, quad-core MediaTek processor at 1.3 GHz and 4 GB internal memory, expandable to 32 GB using a microSD card. The LTE receiver enables downloads at up to 150 Mbps. The NFC-enabled handset running Android 4.4 will be available from 15 July, according to German site Insidehandy.de. The standard price is EUR 200, and the phone is available with a CallYa prepaid tariff for EUR 169. Customers acquiring the Vodafone Smart 4 Power with a Vodafone Smart tariff pay a one-off fee of EUR 19.90. Vodafone also announced the Smart 4 Turbo smartphone, another LTE device running Android 4.4. This will sell for the lower price of EUR 99 on prepaid and comes with a 1.2GHz quad-core processor, 4.5-inch FWVGA touchscreen, 5 MP HD rear camera and front-facing camera. The Turbo also comes with NFC, and both phones will include a quick-start guide and two NFC tags which customers can use to trigger specific actions each time they touch the tag with their phones. The new 4G smartphones will be available across Vodafone markets this summer on both pay-monthly and pre-pay plans, including the Vodafone Red offers.
Tags: vodafone
promotes
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UK: Ted Baker promotes finance director Page to COO
2014-07-10 16:22:00| Daily apparel & textile news and comment - from just-style.com
UK fashion business Ted Baker has promoted Lindsay Page to chief operating officer in addition to his role as group finance director.
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director
finance
ted
Greene River promotes salesman
2014-07-08 19:35:01| Logistics - Topix.net
Rodgers, who has six years produce sales experience, began his career at Eden Prairie, Minn.-based C.H. Robinson Worldwide Inc., before moving to Freedom Fresh LLC in Miami and most recently, selling for Melbourne, Fla.-based Sweet Onion Trading Corp. In his new role, Rodgers will be responsible for business and account development and will work ... (more)
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greene
salesman
Fusion Wafer Bonding Platform promotes 3D-IC/TSV HVM.
2014-07-08 14:31:19| Industrial Newsroom - All News for Today
GEMINI®FB XT, fostering high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs), incorporates SmartView® NT2 bond aligner that enables wafer-to-wafer alignment accuracy to below 200 nm (3 sigma). Along with integrated metrology module that validates alignment after pre-bonding, features include XT Frame platform and additional pre- and post-processing modules for wafer cleaning and surface preparation, plasma activation, and wafer bond alignment. This story is related to the following:Materials and Material ProcessingSearch for suppliers of: Bonding Machinery
Tags: platform
fusion
promotes
bonding
Universal Stainless Promotes Christopher Zimmer to Executive Vice...
2014-07-08 13:29:52| Steel - Topix.net
Universal Stainless & Alloy Products, Inc. announced today that Christopher M. Zimmer has been named Executive Vice President and Chief Commercial Officer of the Company.
Tags: executive
vice
universal
christopher
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