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Software-Designed Controller integrates dual-core processor.

2013-08-09 14:34:28| Industrial Newsroom - All News for Today

Based on LabVIEW reconfigurable I/O architecture, NI cRIO-9068 is suited for demanding embedded control and monitoring tasks. Unit integrates Xilinx Zynq-7020 All Programmable SoC, which combines 667 MHz dual-core ARM® Cortex™ A-9 processor and Xilinx 7 Series FPGA fabric. Offering extended operating temperature of -40 to 70°C, controller features Linux-based, real-time OS that provides flexibility for both LabVIEW Real-Time and C/C++ application developers. This story is related to the following:Embedded Controllers

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Samsung unveils Galaxy S 4 mini with 4.3-inch screen and dual-core processor

2013-05-30 13:23:57| InfoWorld: Top News

Samsung Electronics has announced the Galaxy S 4 mini smartphone, which has a larger screen and a better camera than its predecessor, the Galaxy S III mini. The introduction of a pared-down version of the Galaxy S 4 is in line with Samsung tradition of trying to take advantage of the hype its flagship products have received. The compact version of the Galaxy S 4 comes less than a year after the company announced the Galaxy S III mini in October last year.

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Galaxy S4 Mini may sport dual-core Snapdragon 400 chip

2013-05-29 14:11:37| CNET News.com

Leaked specs allegedly for the S4 Mini point to a Snapdragon 400 processor, 1.5GB of RAM, and an 8-megapixel camera in the back. [Read more]    

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MediaTek Launches The World's First Integrated Platform For Entry Smartphones Featuring Dual-Core HSPA+ SoC With Integrated 4-In-1 Connectivity

2013-05-06 10:11:46| wirelessdesignonline News Articles

MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced the launch of its next-generation, dual-core smartphone platform-- the MT6572. MediaTek's MT6572 is the world's first dual-core SoC with integrated Wi-Fi, FM, GPS and Bluetooth functions targeted at the entry segment and also enables a cost-effective 4-layer PCB design.

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Compal Communications Selects Broadcom® Dual-Core 3G Turnkey Platform for Android ...

2013-04-02 06:00:00| Industrial Newsroom - All News for Today

Enables Leading Taiwanese ODM to Accelerate Smartphone Production<br /> <br /> IRVINE, Calif.<br /> <br /> News Highlights:<br /> <br /> &bull; Broadcom's complete turnkey solution expedites production and lowers costs of 3G smartphones<br /> &bull; New Android smartphones from Compal feature a dual-core HSPA+ processor, VideoCore® multimedia and an advanced connectivity suite for unsurpassed performance at an affordable price point<br /> &bull; Compal expects new smartphones with Broadcom's ...This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Cellular Telephone Software |

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