Laser direct structuring (LDS) enhances molded interconnect device (MID) design flexibility and product capability. In LDS process, part is normally made from plastic material containing LDS additive. Laser then etches conductive trace structures onto any properly designed surface. Initial copper layer, followed by nickel and gold layers, are built up on these structures in subsequent metallization bath. Mold injected parts, from LDS grade materials, can be brought to full-scale production.
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