Home 3D Circuitry Manufacturing leverages LDS process.
 

Keywords :   


3D Circuitry Manufacturing leverages LDS process.

2014-09-26 14:31:06| Industrial Newsroom - All News for Today

Laser direct structuring (LDS) enhances molded interconnect device (MID) design flexibility and product capability. In LDS process, part is normally made from plastic material containing LDS additive. Laser then etches conductive trace structures onto any properly designed surface. Initial copper layer, followed by nickel and gold layers, are built up on these structures in subsequent metallization bath. Mold injected parts, from LDS grade materials, can be brought to full-scale production. This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Circuits

Tags: process manufacturing circuitry lds

Category:Industrial Goods and Services

Latest from this category

All news

31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
05.11PM responds to Sir Alan Bates after repeated requests
05.11American Angus elects 2024-25 board leaders
05.11Atlantic Tropical Weather Outlook
05.11Eastern North Pacific Tropical Weather Outlook
05.11Tropical Storm Rafael Graphics
05.11Tropical Storm Rafael Public Advisory Number 8A
05.11Summary for Tropical Storm Rafael (AT3/AL182024)
05.11Brazil gives green light to medicinal use of Cannabis in animals
More »