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3D Circuitry Manufacturing leverages LDS process.
2014-09-26 14:31:06| Industrial Newsroom - All News for Today
Laser direct structuring (LDS) enhances molded interconnect device (MID) design flexibility and product capability. In LDS process, part is normally made from plastic material containing LDS additive. Laser then etches conductive trace structures onto any properly designed surface. Initial copper layer, followed by nickel and gold layers, are built up on these structures in subsequent metallization bath. Mold injected parts, from LDS grade materials, can be brought to full-scale production. This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Circuits
Tags: process
manufacturing
circuitry
lds
Category:Industrial Goods and Services