Nordson YESTECH FX-940 employs multi-dimensional technology for inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs, and other height-sensitive devices. Along with Fusion Lighting, features include such inspection tools as angled cameras, 3D height sensors, color digital image processing, as well as image- and rule-based algorithms. Inspection rates of >30 in.²/sec are possible.
This story is related to the following:Printed Circuit Board (PCB) Inspection Systems |