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AOI In-Line PCB Inspection System offers 3D capability.

2014-09-02 14:31:59| Industrial Newsroom - All News for Today

Nordson YESTECH FX-940 employs multi-dimensional technology for inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs, and other height-sensitive devices. Along with Fusion Lighting, features include such inspection tools as angled cameras, 3D height sensors, color digital image processing, as well as image- and rule-based algorithms. Inspection rates of >30 in.²/sec are possible. This story is related to the following:Printed Circuit Board (PCB) Inspection Systems |

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Category:Industrial Goods and Services

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