FX-940 ULTRA incorporates 3D technology for inspection of solder defects, lead defects/lifted leads, component presence, as well as co-planarity of chips, BGAs, and other height-sensitive devices. Advanced Fusion Lighting and inspection tools, full-color digital image processing and image- and rule-based algorithms, enable complete inspection coverage with 2D and 3D defect detection. Other features include 12 MP/5 axis 3D NYTVISION Technology and 1 top-down and 4 side viewing cameras.