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AOI Systems support three-dimensional measurement.

2015-03-20 13:31:08| Industrial Newsroom - All News for Today

With PILOT 6 inspection software, GOEPEL electronics AOI systems offer possibility of 3D inspection of solder joints on chip components and IC pins. Surface topography data, generated by integrated 3D·EyeZ measuring module, can be evaluated in various ways to determine solder meniscus quality. Pass/fail decision is based on predefined tolerance limits for each parameter of solder joint or component, and additional functionality covers detection of correctness and assembly faults.

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