Featuring fully automated design, C-SAM® Model DF2400Z images and analyzes voids and other structural defects of power IGBT modules. Inverted transducer, placed beneath module, prevents water from reaching module circuitry. Once recipe for scanning has been defined, factory automation interface controls operation with no need for human attention. Because imaging is typically carried out before encapsulation, acoustic images reveal what type of rework is needed on rejects.