Via combination of hot air reflow, nitrogen purge, and heat circulation vacuum, Eightech Vacuum Reflow RNV Series can reduce presence of solder joint voids when soldering larger PCBs and area-array packages. Flux-free soldering, accomplished by utilizing vacuum reflow in combination with hydrogen/formic acid, provides such benefits as no-flux wash process, minimized influences on insulation resistance and ion migration, as well as void-free soldering.
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