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Advantest Launches TS9000 System For Semiconductor Packaging Inspection
2014-10-02 09:50:54| metrologyworld Home Page
Leading semiconductor test equipment supplier Advantest Corporation announced recently that a new mold thickness metrology system, the TS9000, for measuring the thickness of semiconductor packaging, is available for purchase
Tags: system
inspection
packaging
launches
Category:Industrial Goods and Services
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