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Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX 10 FPGA Products

2015-04-09 12:31:14| Industrial Newsroom - All News for Today

Companies Extend 55nm Embedded Flash Collaboration with Unique Packaging Innovation SAN JOSE, Calif. and HSINCHU, Taiwan  Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level...

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