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Applied Materials Negatively Impacted In A Big Way By 3D Chip Pushouts
2014-05-06 10:01:56| Semiconductors - Topix.net
Now in logic and foundry with the introduction of the new 3D gate architectures, the yield issues our customers are grappling with today are proving to be the most challenging that the industry has ever faced and even the smallest variation in process margin can cause significant yield losses for these devices.
Tags: big
materials
applied
chip
Category:Electronics and Electrical
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