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Bangkok Events to Focus on Solderability, Assembly and Reliability

2013-10-01 06:00:00| Industrial Newsroom - All News for Today

Taking place November 19–20, IPC Southeast Asia Conference on Solder and Reliability will host experts from Asia, Europe, and North America presenting strategies for enhancing reliability in electronics assemblies. Full-day technical conference on November 20, opening with keynote presentation on qualification, will be preceded by full-day workshop on leveraging chip-on-board technology. Other presentations address strategic reliability related to solder alloys and packaging ...This story is related to the following:Trade Associations

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