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CIMB Leads Its First Major Taiwan Deal

2013-09-02 04:48:52| Semiconductors - Topix.net

Acted As Joint Bookrunner In US$400 Million Convertible Bond For Advanced Semiconductor Engineering KUALA LUMPUR, Sept 1 -- CIMB Group acted as joint bookrunner for the US$400 million convertible bond issued by Advanced Semiconductor Engineering , the world's largest independent provider of semiconductor packaging and test services.

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