Powered by Intel® Core™ i7 CPUs and HM76 chipsets, AMB-HM76B1FL and AMB-HM76B1 embedded COM-Express (COMe) basic modules contain two DDR3 SO-DIMMs for up to 16 GB capacity and support Windows® 7, LINUX Kernel 3.3 (Fedora 17), and LINUX Kernel 3.5 (Ubuntu 12.10). Removable design lets systems integrators keep current I/O baseboard and replace with COMe module to optimize current system. While AMB-HM76B1 has on-board cooling fan, AMB-HM76B1FL is fanless.