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Home › Ceramic Substrates support SMT soldering and die attach.

 

Ceramic Substrates support SMT soldering and die attach.

2013-04-18 14:29:44| Industrial Newsroom - All News for Today

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. This story is related to the following:Metallized Ceramics | Substrates

Tags: die support attach ceramic

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