Home › Ceramic Substrates support SMT soldering and die attach.
 

Keywords :   


Ceramic Substrates support SMT soldering and die attach.

2013-04-18 14:29:44| Industrial Newsroom - All News for Today

Consisting of electroless nickel and immersion gold plating over thick film silver, AgENIG® Substrates eliminate solder leaching, enable processing up to 260°C or higher, assure optimal solder connections, and allow multiple SMT reflow solder cycles as well as touch-up and repairs. Addition of thin layer of Palladium plating also allows welding, gold wire bonding, and eutectic die attach. In addition, products based on metallization process can be used up to 170°C continuous operating temperature. This story is related to the following:Metallized Ceramics | Substrates

Tags: die support attach ceramic

Category:Industrial Goods and Services

Latest from this category

All news
31.10Consolidated Financial Statements for the six-month period ended September 30, 2024
31.10Notice regarding the revision of the business results forecasts
Industrial Goods and Services »
05.11PM responds to Sir Alan Bates after repeated requests
05.11American Angus elects 2024-25 board leaders
05.11Atlantic Tropical Weather Outlook
05.11Eastern North Pacific Tropical Weather Outlook
05.11Tropical Storm Rafael Graphics
05.11Tropical Storm Rafael Public Advisory Number 8A
05.11Summary for Tropical Storm Rafael (AT3/AL182024)
05.11Brazil gives green light to medicinal use of Cannabis in animals
More »