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Chip Encapsulants reach full cure in shadowed areas.

2013-07-02 14:30:52| Industrial Newsroom - All News for Today

Designed with UV/Vis light and secondary ambient moisture-cure system, Dual-Cure 9101, 9102, and 9103 are suited for encapsulation applications where shadowed areas are present. Materials are tack free after UV cure, and 2-day moisture cure further shortens time for handling as well as final testing and assembly. With varying viscosities of 7,000, 17,000, and 25,000 cP, products are jet dispensable. Cured materials are flexible and expand with heat, reducing stress on board components. This story is related to the following:Encapsulants

Tags: full areas reach chip

Category:Industrial Goods and Services

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