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Chipset Updates: QUALCOMM, Inc. (QCOM)'s Patent, Intel Corporation...
2013-09-14 10:44:13| Semiconductors - Topix.net
Qualcomm Assigned Patent for Distributed Building Blocks of R-C Clamping Circuitry in Semiconductor Die Core Area QUALCOMM, Inc. , San Diego, has been assigned a patent developed by four co-inventors for a "distributed building blocks of R-C clamping circuitry in semiconductor die core area."
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Category:Electronics and Electrical
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